Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 27(2); 1994
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1994;27(2):109-117. Published online: Nov, 30, -0001

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Electroless Ni Plating for Memory Device Metallization Using Ultrasonic Agitation

  • 우찬희;우용하;박종완;이원해;
    한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;
Abstract

Effect of ultrasonic agitation on the contact properties was studied in Ni electroless plating and Pd activation. P-type Si bare wafers were used as substrate and DMAB was used as reducing agent due to its good electrical properties, solderability and com

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