Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 27(3); 1994
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1994;27(3):158-165. Published online: Nov, 30, -0001

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Cu Electroplating on Patterned Substrate and Etching Properties of Cu-Cr Film for Manufacturing TAB Tape

  • Kim, N. S.;Kang, T.;Yun, I. P.;Park, Y. S.;
    Dept. of Metall. Eng., Seoul National University;Dept. of Metall. Eng., Seoul National University;Dept. of Metall. Eng., Yonsei University;Dept. of Metall. Eng., Yonsei University;
Abstract

Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{circ}C$. The etching rate was increased wi

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