Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 28(2); 1995
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1995;28(2):67-76. Published online: Nov, 30, -0001

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Microstructure Characterization of the Solders Deposited by Thermal Evaporation for Flip Chip Bonding

  • 이충식;김영호;권오경;한학수;주관종;김동구;
    한양대학교 공과대학 재료공학과;한양대학교 공과대학 재료공학과;한양대학교 공과대학 전자공학과;전자통신연구소 반도체실장연구실;전자통신연구소 반도체실장연구실;전자통신연구소 반도체실장연구실;
Abstract

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. A

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