Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 28(3); 1995
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1995;28(3):164-173. Published online: Nov, 30, -0001

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Optimization of Current Distributions of Electroplating on Patterned Substrates with the Auxiliary Electrode

  • 김남석;모화동;강탁;
    서울대학교 금속공학과;서울대학교 금속공학과;서울대학교 금속공학과;
Abstract

Based on the potential-theory model for secondary current distribution, we could predict the thickness distributions of electroplating on patterned substrates with the different size of the auxiliary electrode. The substrates contain lithographic patterns

Keywords