Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 28(3); 1995
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1995;28(3):174-181. Published online: Nov, 30, -0001

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Fabrication Processes of Interconnection Systems for Bare Chip Burn-In Tests Using Epitaxial Layer Growth and Etching Techniques of Silicon

  • 권오경;김준배;
    한양대학교 공과대학 전자공학과;한양대학교 공과대학 전자공학과;
Abstract

Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin fil

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