Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 28(5); 1995
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1995;28(5):309-319. Published online: Nov, 30, -0001

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Metallization on Patterned Substrate

  • 김남석;강탁;남승우;박용수;
    서울대학교 금속공학과;서울대학교 금속공학과;연세대학교 금속공학과;연세대학교 금속공학과;
Abstract

The substrate patterned with the dry film has the cavity which has the $90^{circ}$ wall angle. Electroplating Cu on this patterned substrate has the differrent shape history with the electrochemical parameters. By potential theory model, the re

Keywords