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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 29(1); 1996
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 1996;29(1):3-14. Published online: Nov, 30, -0001
A study of WSi$_2$ film peeling off from Si substrate
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국민대학교 금속재료공학과;국민대학교 금속재료공학과;한국 표준과학 연구원;조선대학교 재료공학과;
Abstract
High temperature anneal of W-rich silicides, inferior to adherence compared with Si-rich silicides, resulted in the film peeling off from the Si-substrate when WSix thickness reached more than critical thickness. Investigation of the W-rich silicide fil
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