Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(3); 1996
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1996;29(3):157-162. Published online: Nov, 30, -0001

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The effects of Cu thin films sputter deposited at 5 and 100 mtorr on the adhesion between Cu/Cr film and polyimide

  • 조철호;김영호;
    한양대학교 재료공학과;한양대학교 재료공학과;
Abstract

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the

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