Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(5); 1996
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1996;29(5):379-385. Published online: Nov, 30, -0001

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THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS

  • Joh, Cheol-Ho;Kim, Young-Ho;Oh, Tae-Sung;Park, Ik-Sung;Yu, Jin;
    Dept. of Materials Engineering, Hanyang University;Dept. of Materials Engineering, Hanyang University;Dept. of Metall. and Mater. Sci., Hongik University;Dept. of Mater. Sci. and Eng., KAIST;Dept. of Mater. Sci. and Eng., KAIST;
Abstract

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited an

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