Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(6); 1996
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1996;29(6):709-713. Published online: Nov, 30, -0001

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PREPARATION OF ANISOTROPIC CONDUCTIVE FINE PARTICLES BY ELECTROLESS NICKEL PLATING.

  • Fujinami, T.;Watanabe, J.;Motizuki, I.;Honma, H.;
    Faculty of Engineering Kanto Gakuin University;Faculty of Engineering Kanto Gakuin University;Faculty of Engineering Kanto Gakuin University;Faculty of Engineering Kanto Gakuin University;
Abstract

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $mu extrm{m}$ diamiter) by electroless nickel plating have been investigated. Genera

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