Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(6); 1996
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1996;29(6):714-719. Published online: Nov, 30, -0001

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GOLD WIRE BONDABILITY OF ELECTROLESS GOLD PLATING USING DISULFITEAURATE COMPLEX

  • Abe, Shinji;Watanabe, Hideto;Igarashi, Yasushi;Honma, Hideo;
    Fac. of Eng. Kanto Gakuin University;Fac. of Eng. Kanto Gakuin University;Fac. of Eng. Kanto Gakuin University;Fac. of Eng. Kanto Gakuin University;
Abstract

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium r

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