Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(6); 1996
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1996;29(6):803-808. Published online: Nov, 30, -0001

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MATERIAL AND ELECTICAL CHARACTERISTICS OF COPPER FILMS DEPOSITED BY MATAL-ORGANIC CHEMICAL TECHNIQUE

  • Cho, Nam-Ihn;Park, Dong-Il;Nam, H. Gin;
    Dept. Electronic Engineering, Sun Moon University;Dept. Electronic Engineering, Sun Moon University;Dept. Electronic Engineering, Sun Moon University;
Abstract

Material and electrical characteristies of copper thin films prepared by metal organic chemical vapor deposition (MOCVD) have been investigated for interconnection applications in ultra large scale integration circuits (ULSI). The copper films have been d

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