Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(2); 1999
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1999;32(2):172-181. Published online: Nov, 30, -0001

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A Study on Electroless Ni-B Plating with DMAB as Reducing Agent. I. The Electrochemical Behavior of Precipitation Reaction on Austenite Stainless Steel Substrates

  • 이창래;박해덕;강성군;
    한양대학교 공과대학 재료공학과;(유) 해송피앤씨;한양대학교 공과대학 재료공학과;
Abstract

The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and

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