Oct, 31, 2024

Vol.57 No.5

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(3); 1999
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1999;32(3):211-213. Published online: Nov, 30, -0001

PDF

Pb-FREE SOLDER PLATING

  • Yada, Y.;Tokio, K.;
    2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;
Abstract

In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result

Keywords Pb-free;Sn-Ag;Meling point;Solderability;Environment-free;