Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(4); 1999
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1999;32(4):496-502. Published online: Nov, 30, -0001

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A study on the adhesion of Ag film deposited on Alloy42 substrate

  • 이철룡;천희곤;조동율;이건환;권식철;
    울산대학교 재료공학과;울산대학교 재료공학과;울산대학교 재료공학과;한국기계연구원;한국기계연구원;
Abstract

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associ

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