Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(4); 1999
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1999;32(4):503-512. Published online: Nov, 30, -0001

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The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process

  • 조원구;김영호;김창경;
    한양대학교 공과대학 재료공학부;한양대학교 공과대학 재료공학부;한양대학교 공과대학 재료공학부;
Abstract

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate

Keywords