Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(6); 1999
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1999;32(6):647-657. Published online: Nov, 30, -0001

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Fracture Toughness of Leadframe/EMC Interface

  • 이호영;유진;
    한국과학기술원 재료공학과;한국과학기술원 재료공학과;
Abstract

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion

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