Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 35(1); 2002
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2002;35(1):11-16. Published online: Nov, 30, -0001

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A Study on the Characteristics of Sn-Ag-X Solder Joint -The Wettability of Sn-Ag-Bi-In Solder to Plated Substrates-

  • 김문일;문준권;정재필;
    서울시립대학교 공과대학 재료공학과;서울시립대학교 공과대학 재료공학과;서울시립대학교 공과대학 재료공학과;
Abstract

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar mel

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