Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 35(1); 2002
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2002;35(1):47-52. Published online: Nov, 30, -0001

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A Study on the of Intermetallic compound and shear strength of Sn3.5Ag0.7Cu ball with interface position

  • 신규식;박지호;정재필;
    서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;
Abstract

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals an

Keywords