Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 36(1); 2003
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2003;36(1):34-41. Published online: Nov, 30, -0001

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Effect of Additives and Plating Conditions on Sn-Pb Alloy Film of Semiconductor Formed by High Speed Electroplating

  • 정강효;김병관;박상언;김만;장도연;
    창원대학교 화공시스템공학과;창원대학교 화공시스템공학과;한국기계연구원 표면연구부;한국기계연구원 표면연구부;한국기계연구원 표면연구부;
Abstract

Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficien

Keywords Stannic oxide;Tetravalent tin;Gallic acid;Carbon content;