- Past Issues
- e-Submission
-
2021 Impact Factor 1.766
5-Year Impact Factor 1.674
Editorial Office
- +82-2-563-0935
- +82-2-558-2230
- submission@kssse.or.kr
- https://www.kssse.or.kr/
Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(2); 2003
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2003;36(2):168-175. Published online: Nov, 30, -0001
The Study of Solderability according to Chemical Analysis in Plating Process
-
삼성전기 MLCC사업부;
Abstract
The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB`s. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderabil
Keywords MLCC;CVS;Solderability;